Tasneem Khan Shifa, and Dr. Md. Faruque Hossain. “Thermal Stress Analysis of BGA Packaging Structure”. Global Journals of Research in Engineering 18, no. F3 (May 15, 2018): 43–49. Accessed May 4, 2024. https://engineeringresearch.org/index.php/GJRE/article/view/1842.