E.H. WONG. Creep Fatigue of Solder Joints in Electronic Assemblies. Global Journals of Research in Engineering, [S. l.], v. 23, n. J4, p. 7–20, 2024. Disponível em: https://engineeringresearch.org/index.php/GJRE/article/view/101641. Acesso em: 3 jul. 2024.