@incollection{, 2EF79B5875A37B4CA1A1523CBEC18A08 , author={{PalashMondal} and {Md. Abdullah AlAhad} and {}}, journal={{Global Journal of Researches in Engineering}}, journal={{GJRE}}2249-45960975-586110.34257/gjre, address={Cambridge, United States}, publisher={Global Journals Organisation}1415964 } @incollection{b0, , title={{}} , journal={{IEEE Transactions on Electron Devices}} 21 , year={1974} } @incollection{b1, , title={{Cooled printed circuit boards}} , booktitle={{Proc. Of THERMINIC}} Of THERMINIC , year={2000} } @book{b2, , title={{}} , author={{ MNecati } and { HeatOzisik } and { Transfer }} , year={2008} , note={ninth edition} } @book{b3, , title={{Conduction of Heat in Solids}} , author={{ HSCarslaw } and { JCJaeger }} , year={1959} , address={Ed., Clarendon, Oxford} , note={Second} } @incollection{b4, , title={{Path-independent integrals for heat conduction analysis in electrothermal crack problem}} , author={{ MSaka } and { HAbé }} , journal={{Journal of Thermal Stresses}} 15 1 , year={1992} } @incollection{b5, , title={{Current density and temperature distribution neat the corner of angled metal line}} , author={{ KSasagawa } and { MSaka } and { HAbé }} , journal={{Mechanics Research Communication}} 22 5 , year={1995} } @incollection{b6, , title={{Electrical conduction in solids, II. Theory of temperaturedependent conductors}} , author={{ JAGreenwood } and { JB PWilliamson }} , journal={{Proc. Royal Society of London}} 246 , year={1244. 1958} , note={A} } @incollection{b7, , title={{Heat conduction in a symmetric body subjected to a current flow of symmetric input and output}} , author={{ MSaka } and { YXSun } and { SRAhmed }} , journal={{International Journal of Thermal Sciences}} 48 , year={2009} } @incollection{b8, , title={{Electro-thermal crack analysis in a finite conductive layer with temperaturedependent material properties}} , author={{ YHJang }} , booktitle={{Heat Transfer}} , publisher={P. Hallman} , year={2005. 2006} 38 , note={ninth edition} }