@incollection{,
	
					
					
					06DFD8812B6B2A1FC154610015C66CC5
				,
	author={{Tasneem KhanShifa} and {Dr. Md. FaruqueHossain} and {}},
	journal={{Global Journal of Researches in Engineering}},
	journal={{GJRE}}2249-45960975-586110.34257/gjre,
	address={Cambridge, United States},
	publisher={Global Journals Organisation}1834349
}

@book{b0,
	
	
		,
	title={{Ball grid array}}
		
		
	

}

@book{b1,
	
	
		,
	title={{Characterization for ball grid array}}
		
		
	

}

@book{b2,
	
	
		,
	title={{Mechanical analysis of ball grid array packages}}
		
		
	

}

@incollection{b3,
	
	
		,
	title={{Analysis on Thermal Stress and Thermal Reliability of BGA Packaging}}
		,
	author={{
			WGLuo
		}}
	
	
		,
	booktitle={{IEEE International Electronic Manufacturing Technology Symposium}}
				China
		
			,
	year={2009}
		
	

}

@incollection{b4,
	
	
		,
	title={{Polymer core BGA stress analysis at higher vertical loading}}
		,
	author={{
			ZSauli
		} and {
			VRetnasamy
		} and {
			RVairavan
		} and {
			KAnwar
		} and {
			NAbdullah
		}}
		
		
		
		
	
	
		,
	journal={{Social and Behavioral Science}}
		
			
			,
	year={2014}
		
	

}

@incollection{b5,
	
	
		,
	title={{Study of the Thermal Field and Thermal Stress Field of Typical BGA Packaging by Numerical Simulation}}
		,
	author={{
			QGao
		} and {
			KKWang
		}}
		
	
	
		,
	booktitle={{International Conference on Electronic Packaging Technology}}
				Chengdu
		
			,
	year={2014}
		
	

}

@incollection{b6,
	
	
		,
	title={{State analysis of temperature field of electronic package with power chip}}
		,
	author={{
			KKWang
		} and {
			LWang
		} and {
			LWang
		} and {
			YZWang
		}}
		
		
		
	
	
		,
	booktitle={{International Conference on Electronic Packaging Technology}}
				Dalian
		
			,
	year={2013}
		
	

}

@incollection{b7,
	
	
		,
	title={{A Parametric Study of Flip Chip Reliability Based on Solder Fatigue Modeling}}
		,
	author={{
			SFPopelar
		}}
	
	
		,
	booktitle={{IEEE/CMPT International Electronic Manufacturing Technology Symposium}}
				
			,
	year={1997}
			
		
	

}

@incollection{b8,
	
	
		,
	title={{Impact of Solder Pad Size on Solder Joint Reliability in Flip Chip PBGA Packages}}
		,
	author={{
			LLMercado
		} and {
			VSarihan
		} and {
			YFGuo
		} and {
			Mawer
		}}
		
		
		
	
	
		,
	booktitle={{49th Electronic Components and Technology Conference}}
				San Diego, CA, USA
		
			,
	year={1999}
			
		
	

}

@incollection{b9,
	
	
		,
	title={{FCOB Reliability Evaluation Simulating Multiple Rework/Reflow process}}
		,
	author={{
			WChen
		}}
	
	
		,
	journal={{IEEE Transactions on Components, Packaging, and Manufacturing Technology-Part C}}
		
			19
			4
			
			,
	year={October 1996}
		
	

}

@book{b10,
	
	
		,
	author={{
			BRosner
		} and {
			JLiu
		} and {
			ZLai
		}}
		
		
		,
	title={{Flip Chip Bonding Using Conductive Adhesives Electronic Components and Technology Conference}}
				USA
		
			,
	year={1996}
			
		
	

}

@book{b11,
	
	
		,
	title={{Ball grid array (BGA) package}}
		
		
	
	,
	note={Ball grid array, BGA}

}

@book{b12,
	
	
		,
	title={{Optimization of Structure for BGA Packaging Based on Taguchi Method}}
		,
	author={{
			GEZhipeng
		} and {
			WKaikun
		}}
		
		
			,
	address={Beijing, China}
		
		
			School of Materials Science and Engineering University of Science and Technology Beijing
		
	

}