@incollection{,
	
					
					
					7C33B9CDB964DEE69ACB2F27E48BCFC9
				,
	author={{AizatAbas} and {Fei ChongNg} and {MZAbdullah} and {MHHIshak} and {Universiti Sains Malaysia (Engineering Campus)}},
	journal={{Global Journal of Researches in Engineering}},
	journal={{GJRE}}2249-45960975-586110.34257/gjre,
	address={Cambridge, United States},
	publisher={Global Journals Organisation}1671721
}

@incollection{b0,
	
	
		,
	title={{Plastic ball grid array (PBGA) overview}}
		,
	author={{
			JJLiu
		} and {
			HBerg
		} and {
			YWen
		} and {
			SMulgaonker
		} and {
			RBowlby
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			AMawer
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@incollection{b1,
	
	
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	title={{Stacked solder bumping technology for improved solder joint reliability}}
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	author={{
			XingshengLiu
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			ShuangyanXu
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	booktitle={{Microelectronics Reliability}}
				
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	year={2001}
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}

@incollection{b2,
	
	
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	title={{Fluidstructure interaction analysis on the effect of chip stacking in a 3D integrated circuit package with through-silicon vias during plastic encapsulation}}
		,
	author={{
			ESErnest
		} and {
			MZOng
		} and {
			CYAbdullah
		} and {
			Khor
		}}
		
		
		
	
	
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	journal={{Microelectronic Engineering}}
		
			113
			
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	year={2014}
		
	

}

@incollection{b3,
	
	
		,
	title={{Analysis of encapsulation process in 3D stacked chips with different micro bump array}}
		,
	author={{
			ESErnest
		} and {
			MZOng
		} and {
			CYAbdullah
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			Khor
		}}
		
		
		
	
	
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	booktitle={{International Communications in Heat and Mass Transfer}}
				
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	year={2012}
			39
			
		
	

}

@book{b4,
	
	
		,
	title={{Effects of outlet vent arrangement on air traps in stacked-chip scale package encapsulation}}
		,
	author={{
			DRamdan
		} and {
			MZAbdullah
		}}
		
		
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	year={2012}
			39
			
		
	
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	note={International Communications in Heat and Mass Transfer}

}

@book{b5,
	
	
		,
	title={{Chapter 3 -Encapsulation Process Technology, Encapsulation Technologies for Electronic Applications}}
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	author={{
			HArdebili
		} and {
			MGPecht
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	year={2009}
			,
	publisher={Elsevier}
			
		
	

}

@incollection{b6,
	
	
		,
	title={{Effect of ILU dispensing types for different solder bump arrangements on CUF encapsulation process}}
		,
	author={{
			AizatAbas
		} and {
			MSHaslinda
		} and {
			MH HIshak
		} and {
			ASNurfatin
		} and {
			MZAbdullah
		} and {
			FCheAni
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	journal={{Microelectronic Engineering}}
		
			,
	year={2016}
		
	

}

@incollection{b7,
	
	
		,
	title={{Lattice Boltzmann Method of Different BGA Orientations on I-Type Dispensing Method}}
		,
	author={{
			AizatAbas
		} and {
			MhhGan
		} and {
			Ishak
		}}
		
		
	
	
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	journal={{PLoS ONE}}
		
			11
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			e0159357
			,
	year={2016}
		
	

}

@incollection{b8,
	
	
		,
	title={{Lattice Boltzmann and finite volume simulations of multiphase flow in BGA encapsulation process}}
		,
	author={{
			AizatAbas
		} and {
			MhhAbdullah
		} and {
			Ishak
		}}
		
		
	
	
		,
	journal={{ARPN Journal of Engineering and Applied Sciences}}
		
			,
	year={2015}
		
	

}

@incollection{b9,
	
	
		,
	title={{Thermal conductivity of single and multi-stacked DI-BSCCO tapes}}
		,
	author={{
			TomoyukiNaito
		} and {
			HiroyukiFujishiro
		}}
		
	
	
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	journal={{Cryogenics}}
		
			49
			
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	year={2009}
		
	

}

@incollection{b10,
	
	
		,
	title={{Thermal resistance of side by side multi-chip package: Thermal mode analysis}}
		,
	author={{
			Dao-LongChen
		} and {
			Tei-ChenChen
		}}
		
	
	
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	booktitle={{Microelectronics Reliability}}
				
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	year={2015}
			55
			
		
	

}

@incollection{b11,
	
	
		,
	title={{Impact of die thinning on the thermal performance of a central TSV bus in a 3D stacked circuit}}
		,
	author={{
			SamsonMelamed
		} and {
			Fumitoimura
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		,
	journal={{Microelectronics Journal}}
		
			,
	year={2015}
		
	

}

@incollection{b12,
	
	
		,
	title={{Effect of thermo capillary action in the underfill encapsulation of multi-stack ball grid array}}
		,
	author={{
			ChongFei
		} and {
			AizatNg
		} and {
			MhhAbas
		} and {
			Ishak
		} and {
			AbdulAbdullah
		} and {
			Aziz
		}}
		
		
		
		
		
	
	
		,
	booktitle={{Microelectronics Reliability}}
				
			,
	year={2016}
		
	

}