@incollection{,
	
					
					
					9BE089A2189BB9265B29DD21C1996CF1
				,
	author={{Mr. PrashantKumar} and {Dr. AjitaPathak} and {Amity University, India}},
	journal={{Global Journal of Researches in Engineering}},
	journal={{GJRE}}2249-45960975-586110.34257/gjre,
	address={Cambridge, United States},
	publisher={Global Journals Organisation}1511724
}

@incollection{b0,
	
	
		,
	title={{Toward Generic Fully Integrated Gate Driver Power Supplies}}
		,
	author={{
			NRouger
		} and {
			JCCrebier
		}}
		
	
	
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	booktitle={{Power Electronics on IEEE Transactions}}
				
			,
	year={July 2008}
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}

@incollection{b1,
	
	
		,
	title={{From Packaging to "Un"-Packaging Trends in Power Semiconductor Modules}}
		,
	author={{
			TStockneier
		}}
	
	
		,
	booktitle={{Power Semiconductor Devices and IC's 2008, ISPSD'08, 20 th International Symposium}}
				
			,
	year={May 2008}
			1
			
		
	

}

@incollection{b2,
	
	
		,
	title={{Ribbon Bonding -A Scalable Interconnect for Power QFN Packages}}
		,
	author={{
			CLuechinger
		}}
	
	
		,
	booktitle={{Electronics Packaging Technology Conference (EPTC) 2007}}
				
			,
	year={December 2007}
			9
			
		
	

}

@incollection{b3,
	
	
		,
	title={{Development of Matrix Clip Assembly for Power MOSFET Packages}}
		,
	author={{
			MKengen
		} and {
			WPeels
		} and {
			DHeges
		}}
		
		
	
	
		,
	booktitle={{Microelectronics and Packaging Conference 2009 (EMPC'09)}}
				
	
	,
	note={European Voulme 4}

}

@incollection{b4,
	
	
		,
	title={{Simulation of Migration Effect in Solder Bumps, Device and Material Reliability}}
		,
	author={{
			KZaageWeide
		}}
	
	
		,
	booktitle={{IEEE Transactions}}
				
			,
	year={September 2008}
			8
			
		
	

}

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		,
	title={{Analysis and Suppression of Inductive Interference in Active Integrated Power Electronics Module}}
		,
	author={{
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		} and {
			XuYang
		} and {
			ZhoanWang
		} and {
			LianghuaZhang
		}}
		
		
		
	
	
		,
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			,
	year={June 2007}
			
		
	

}

@incollection{b6,
	
	
		,
	title={{Characterization of PVD-TiN as the Diffusion Barrier/Adhesion Promoter for use in a multilevel copper Interconnection Technology}}
		,
	author={{
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		} and {
			SPMuraka
		}}
		
	
	
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	year={1995. May 1995}
			
		
	
	,
	note={Proceedings of the Eleventh Blennial}

}

@incollection{b7,
	
	
		,
	author={{
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		} and {
			CCYou
		} and {
			MSTsai
		} and {
			SFHu
		} and {
			KLee
		} and {
			JLu
		}}
		
		
		
		
		
	
	
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	booktitle={{Growth of Nano Sized Copper Seed Layer on TiN and TaSiN by new Non-Toxic Electroless Plating}}
				
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	year={2002. 2002. 2002}
			
		
	
	,
	note={Proceedings 2002, 2 nd IEEE Conference}

}

@book{b8,
	
	
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	author={{
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			DRGross
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	title={{Trends in MCM and Microelectronics Assembly}}
				
			,
	publisher={MCB Up Limited}
		
	

}

@book{b9,
	
	
		,
	title={{Design and Characterization of an Integrated CMOS Gate Drive for Power MOSFETs}}
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	author={{
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		} and {
			NRouger
		} and {
			JCCreiber
		}}
		
		
		ECCE 2010
		
	

}

@incollection{b10,
	
	
		,
	title={{Design of a Synchronous -Rectified Back Bootstrap MOSFET drives for Voltage Regulator Module}}
		,
	author={{
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		} and {
			WeiYan
		} and {
			WenhongLi
		}}
		
		
	
	
		,
	booktitle={{ASIC 2007, ASICON'07, 7 th International Conference}}
				
			,
	year={October 2007}
			
		
	

}

@incollection{b11,
	
	
		,
	title={{Integrated Transformer -Coupled Isolation}}
		,
	author={{
			RKliger
		}}
	
	
		,
	journal={{IEEE Xplore}}
		
			6
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	year={March 2003}
		
	
	,
	note={Instrumentation and Measurement Magazine}

}

@book{b12,
	
	
		,
	title={{Loss Free Gate Driver Unipolar Power Supply for High Side Power Transistors}}
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	author={{
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	year={May 2008}
			23
			
		
	

}

@incollection{b13,
	
	
		,
	title={{Designing with Thermal Impedance}}
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	author={{
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	year={1988}
		
	

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	author={{
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		} and {
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	year={1990}
			
		
	

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	title={{An Introduction to High Performance Laminates and the Importance of Using Chemical Process in PCB Fabrication}}
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	author={{
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		} and {
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	booktitle={{Rohm and Haas Electronic Materials}}
				
	

}

@incollection{b16,
	
	
		,
	title={{Indian Patent Office: 790/DEL/2013; Inventor: Prashant Kumar}}
		,
	author={{
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		} and {
			RaviMukherjee
		} and {
			Pillarisetty
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		Patent: US 7964 490 B2
	
	
		,
	booktitle={{Methods of Forming Nickel Sulfide Film on a Semiconductor Device}}
				
			,
	year={June 21, 2011. March 19, 2013}
			18
		
	
	,
	note={Application of Innovative 3D Transistor in Home Appliances}

}